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References
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 | U.S. Patent No. 4,925,723, "Microwave integrated circuit substrate including metal filled via holes and method of manufacture." |
| U.S. Patent No. 5,023,994, "Method of manufacturing a microwave intergrated circuit substrate including metal lined via holes." |
| F. Sechi, et al., "Radially-Combined 30-W, 14-16 GHz Amplifier," IEEE MTT-S Symposium Digest, 1994, pp. 1737-1740. |
| F. Sechi, et al., "Miniature Beryllia Circuits for Ku-Band Power Amplifiers," IEEE MTT-S Symposium Digest, 1983, p. 530. |
| F. Sechi, M. Bujatti, "Broadband Power Amplifiers Based on a New Monolithic Ceramic Technology," IEEE MTT-S Symposium Digest, 1989, pp. 937-940. |
| M. Bujatti, "Technological Trends in GaAs MESFETs for mm-Wave Applications," Invited Paper, 13th European Microwave Conference, Nurnberg, Germany, September 1983. |
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