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Monolithic Ceramic TechnologyMicrowave Power Inc. has developed a proprietary Monolithic Ceramic Circuits technology specifically optimized for power applications. We have transferred to ceramic substrates many of the technological advances routinely used in the monolithic field (especially on silicon), such as all dry processing and plasma-deposited silicon nitride. We have added a few key proprietary elements, such as solid via holes and air bridges. As a result, the hybrid approach has been upgraded to a semi-monolithic, miniaturized technology, most effective in power applications, but also ideally suited to multichip integration of monolithic circuits at all power levels. One of the most characteristic features is the introduction of solid gold vias into the ceramic substrate. These vias, placed directly under the active devices and in other critical positions, act as effective heat sinks and low inductance ground connections. This technology offers a wide flexibility and allows us to respond in a short time to
most customized requests. Depending on the requirement, we use a combination of three
different approaches:
Using modular structures, we combine all three approaches to achieve the best overall performance.
See the fabrication services and reference section for further information.
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3350 Scott Blvd, Bldg. 25 Santa Clara, CA 95054 USA Voice: (408) 727-6666 Fax: (408) 727-2246 Email: info@microwavepower.com
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